This thesis, developed with the Infineon Technologies, presents the complete design of buck converter with integrated power switches, from Matlab modeling to the transistor level implementation. The proposed DC-DC converter is intended to replace a linear regulator employed by the company into their products to provide an output voltage of 16V from a input supply of 125V . Since the efficiency of this traditional linear regulator is defined theoretically by the ratio between the output voltage and the input voltage, the efficiency is low and, consequently, the power dissipation is high, forcing the power switch, a BJT, to be placed externally. Given the high efficiency of the buck converter, normally above 90%, its adoption brings the possibility of integrating the MOS power switches, increasing reliability, saving space on PCB and reducing system costs by eliminating the external BJT with its thermal heat sinking. In this way, the proposed implementation aims to provide the company with a more advanced and competitive solution.
Modellazione e Progettazione a Livello di Transistore di un Convertitore CC-CC Buck con Transistore di Potenza Integrati
Modeling and Transistor Level Design of a Buck DC-DC Converter with Integrated Power Switches
OLIVEIRA JUNIOR, JAMES HAMILTON
2020/2021
Abstract
This thesis, developed with the Infineon Technologies, presents the complete design of buck converter with integrated power switches, from Matlab modeling to the transistor level implementation. The proposed DC-DC converter is intended to replace a linear regulator employed by the company into their products to provide an output voltage of 16V from a input supply of 125V . Since the efficiency of this traditional linear regulator is defined theoretically by the ratio between the output voltage and the input voltage, the efficiency is low and, consequently, the power dissipation is high, forcing the power switch, a BJT, to be placed externally. Given the high efficiency of the buck converter, normally above 90%, its adoption brings the possibility of integrating the MOS power switches, increasing reliability, saving space on PCB and reducing system costs by eliminating the external BJT with its thermal heat sinking. In this way, the proposed implementation aims to provide the company with a more advanced and competitive solution.È consentito all'utente scaricare e condividere i documenti disponibili a testo pieno in UNITESI UNIPV nel rispetto della licenza Creative Commons del tipo CC BY NC ND.
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https://hdl.handle.net/20.500.14239/13620